Advanced AI Software for Semiconductor Metrology

JUST CLICK... AND THAT’S IT

Quartz Imaging has been providing metrology tools to the semiconductor industry for more than 30 years.

Our Artificial Intelligence driven Quartz PCI-AM product offers three levels of automation for semiconductor metrology in electron microscope images.

The first level allows you to simply click inside a device feature and it will be automatically measured in accordance with a "recipe" that has been set up.

With the second level of automation, you can fully characterize a complete image with a single click.

The third and most powerful level of automation allows you to automatically characterize an entire folder of images based on a template image that you have measured.

So, whether you need to measure one image, a small batch, or thousands of images, using Quartz PCI-AM can be a huge time saver.

What's NEW in QUARTZ PCI-AM 9

Template Matching:

At the heart of PCI-AM 9 is its new template matching engine, which allows users to design templates using an intuitive graphical editor and to specify what measurements are desired. Once designed, the software uses machine learning to automatically identify, align, and measure all instances of the template feature within individual and batched microscope images—no manual intervention required. This dramatically reduces measurement time, improves repeatability, and ensures consistency among users.

Lock Existing Measurements:

You can lock or “finalize” existing measurements so that edge detection parameters can be adjusted between measurements without affecting existing measurements and so that measurements can overlap with each other.

Labeling:

  • You can specify that feature labels should be shown on the image.

Tolerances:

  • Out of tolerance measurements are highlighted on the image.

Colors and Fonts:

  • You can specify the colors and fonts used for measurements within the settings for each measurement.

Vertical Reference Lines:

  • You can add vertical reference lines to your image that can be used as endpoints for horizontal measurements. You can also specify the location of the X origin.

Improved Point-and-Shoot:

  • The point-and-shoot measurements have been improved:
    • Measurements recalculate when moved.
    • Holding down the Ctrl key and dragging a point-and-shoot tool will automatically perform a specified number of equidistant measurements between the end points of the specified line.
    • Holding down the Shift key and dragging a point-and-shoot tool will automatically measure all segments between the endpoints.
    • The endpoints of each point-and-shoot measurement are recorded in the measurement grid and output to the CSV file.

Improved Measurements:

  • In addition to measuring the maximum depth and height of trenches and pillars, you can choose to measure the depth and height at the center of the feature.
  • Similarly, in addition to measuring the Maximum and minimum caliper of shapes, you can measure the maximum width and height or the width and height through the geometric center of the shape.
  • A multipoint measurement has been added to the shape tool that allows you to Measure a specified number of widths across the shape.
  • A radius of curvature measurement has been added.
  • A pitch measurement has been added.
  • The collinearity measurement now outputs signed values.
  • You can press the Shift key to make a measurement on top of a reference line instead of moving the reference line.
  • A checkbox is provided on the File Export dialog to export measurements.

Filters:

  • A bilateral filter has been added to the preprocessing filters available. The bilateral filter smooths the image while preserving edges. The speed of filtering operations has been increased.

Preprocessing:

  • You can choose to perform autorotation, rotation by arbitrary angle, tilt correction or auto histogram immediately upon entry to AM mode or in batch processing.
  • The Process | Rotate | Align Horizontal Reference function can be used to rotate the image so as to make the horizontal reference line horizontal.

Batch Mode:

  • Batch mode sorts measured images into separate Pass, Fail and Reject folders.
  • Exact match of image sizes is no longer required in batch mode.

Menus:

  • The PCI-AM functions have been moved to a separate Feature menu for ease of access and to reduce complexity.

 

 

PCI-AM Benefits

  • Save Time
  • Increase Measurement Consistency
  • Generate Reports Easily with Images and Data
  • Increase Measurement Accuracy
  • Export Data Easily into CSV File

TYPES OF AUTOMATED MEASUREMENTS

Template Matching:

  • With our new Template Editor, you can easily design and draw custom templates, and PCI-AM will automatically detect and measure every instance of those templates across your images.
Template Matching
Template Matching

Trenches (Spaces) and Pillars (Lines)

  • Radius of Curvature
  • CD Width
  • Angles – Sidewall and Center
  • Multiple Regions in Feature
  • Line Edge Roughness
  • Line Width Roughness
  • Distances Below and Above Reference Line
  • Averages of the Above Measurements
Trench Measurements
Trench Measurements

Macro Cell

  • Multiple Measurements in Complex Features with a Single Click
Macro Cell
Macro Cell

Shapes

  • Area and Perimeter
  • Aspect Ratio
  • Major and Minor Axes
  • Collinearity
  • Ideal Shape Deviation
  • Tilt
Shape Measurements
Shape Measurements

Other Valuable PCI-AM Features

  • "Point and Shoot" Horizontal and Vertical Measurement Tools Utilize Edges
  • Regular PCI Measurement Tools will "Snap" to the Edges in PCI-AM
  • Predetermine the Number and Exact Location of CD Measurements Relative to the Reference Line
  • Advance Edge Detection Model
More on Quartz PCI-AM